Computex 2021 is an opportunity for AMD to reveal an unknown 12-core Ryzen. This processor is a prototype highlighting the “3D V-Cache” technology. What is it about ? What is its purpose ?
The arrival of Rocket Lake-S has enabled Intel to reaffirm its presence in the field of processors, in particular in the gaming segment. This is precisely the market coveted by AMD with this innovation from V-Cache Packing.
It was presented through a modified version of the current Ryzen 9 5900X. This chip has 12 physical cores and 24 logical cores.
Ryzen 9 3900X equipped with 3D V-Cache technology.
The prototype presented by AMD is based on the same architecture with the presence of 12 Zen 3 cores. The difference lies in the design with the arrival of a stack of DRAM on top of the “compute tiles”. This approach, called “3D V-Cache”, adds no less than 64 MB of additional L3 cache to the chip.
AMD – Ryzen 9 5900X processor equipped with 3D V-Cache technology
According to AMD, the results on the performance side are promising. At a fixed frequency of 4 GHz, this prototype compared to the classic Ryzen 5900X is on average 15% faster.
The manufacturer stressed that the first products taking advantage of this 3D V-Cache should land by the end of the year. It is possible that this is one of the improvements planned with the Zen 3+ architecture.
“AMD continues to build on its premier IP portfolio and invests in advanced technologies for manufacturing and packaging with AMD 3D Chiplet technology. A breakthrough in packaging, which combines AMD’s innovative chiplet architecture with 3D stacking using a cutting edge approach to create a hybrid bond. This results in an interconnection density of 2D chips 200 times higher and a density compared to existing 3D packaging solutions 15 times higher. Launched in close collaboration with TSMC, this technology also consumes less energy1 than current 3D solutions and is the most flexible so-called active-on-active silicon stacking technology in the world.
AMD showcased the first application of 3D Chiplet technology during COMPUTEX 2021: a vertical 3D cache connected to an AMD Ryzen 5000 series processor prototype and designed to deliver significant performance gains in a wide range of applications. AMD is on track to begin production of future high-end computer products including 3D Chiplet technology by the end of this year. ”